Directional Heat Dissipation Assembly and Method

A directional heat dissipation assembly, the assembly comprising:

• a transistor, the transistor defined by a top surface, a bottom surface, and a sidewall, the transistor comprising a heat source configured to generate heat;
• a heat reservoir, the heat reservoir configured to enable storage and at least partial dissipation of the heat, the heat reservoir disposed to join with the bottom surface of the transistor;
• at least one conduction channel, the at least one conduction channel configured to carry an electrical current between the heat source and the heat reservoir;
• a coupling barrier, the coupling barrier disposed to operatively join with the heat source, the coupling barrier configured to join with at least a portion of the bottom surface of the transistor, the coupling barrier further configured to join with at least a portion of the top surface of the transistor, the coupling barrier further configured to enable electrical insulation at the bottom surface and the top surface of the transistor, the coupling barrier further configured to enable conduction of the heat from the heat source towards the heat reservoir from the bottom surface and the top surface of the transistor;
• a directional heat guide member, the directional heat guide member configured to join with the coupling barrier, the directional heat guide member further configured to directionally transfer the heat towards the bottom surface and the top surface of the transistor, the directional heat guide member further configured to directionally transfer the heat away from the sidewall of the transistor, the directional heat guide member comprising at least one of the following:
• a first thermal conductive layer formed to the coupling barrier, the bottom surface, or the top surface of the transistor, the first thermal conductive layer defined by a first thermal conductivity;
• a first thermal insulative layer formed to the first thermal conductive layer, the first thermal insulative layer defined by a second thermal conductivity configured to be lower than the first thermal conductivity;
• a second thermal conductive layer formed to the first thermal insulative layer, the second thermal conductive layer defined by a third thermal conductivity configured to be higher than the second thermal conductivity, the third thermal conductivity further configured to be about equal to the first thermal conductivity;
• and
• a second thermal insulative layer formed to the second thermal conductive layer, the second thermal insulative layer defined by a fourth thermal conductivity, the fourth thermal conductivity configured to be lower than the first thermal conductivity and the third thermal conductivity, the fourth thermal conductivity further configured to be about equal to the second thermal conductivity,
• whereby the layers are sequentially arranged in a layered configuration.