Semiconductor test pad with stacked thin metal sheets and method for manufacturing the same

Abstract

The present invention relates to a semiconductor test pad used in a semiconductor test, and more specifically, to a semiconductor test pad with stacked metal sheets, which is manufactured by preparing a first sheet using a thin metal plate, etching and stacking and then vertically cutting the first sheet, and a method for manufacturing the same. The semiconductor test pad includes first layers, each of which includes an insulator rectangular in cross section and having a predetermined length along a Y-axis direction, and second layers, each of which includes a plurality of rectangular conductors passing, in a Z-axis direction and at predetermined intervals, through insulators each rectangular in cross section and having the same height along the Z-axis direction as the first layer and the same length along the Y-axis direction, wherein the first layers and the second layers are alternately stacked along the X-axis direction, thus allowing the semiconductor test pad to overall look like a rectangular pad, and wherein first layers are positioned at both end portions along the X-axis.

Dependencies are inferred from the claim text.