Method for Detecting a Crack in a Semiconductor Body of a Semiconductor Component

A method for detecting a crack in a semiconductor body of a semiconductor component, the method comprising:

• providing a semiconductor component with:
• a semiconductor body having a bottom side, a top side spaced distant from the bottom side in a vertical direction, and a thickness in the vertical direction;
• and
• a crack sensor configured to detect a crack in the semiconductor body, wherein the crack sensor extends into the semiconductor body, and wherein a distance between the crack sensor and the bottom side is less than the thickness of the semiconductor body;
• specifying a first value of a characteristic variable of the crack sensor;
• determining a second value of the characteristic variable of the crack sensor at a different time than the first value is specified;
• and
• determining the semiconductor body has a crack if the second value differs from the first value by more than a pre-defined difference.