Wafer dividing method

A method of dividing a wafer, having on one side a device area with a plurality of devices partitioned by a plurality of division lines, into dies, the method comprising:

• attaching an adhesive tape for protecting devices on the wafer to the one side of the wafer;
• attaching a carrier for supporting the adhesive tape to the side of the adhesive tape being opposite to the side facing the one side of the wafer by an attachment means;
• grinding the side of the wafer being opposite to the one side for adjusting the wafer thickness;
• applying a protective layer to the side of the wafer being opposite to the one side after grinding;
• and
• cutting the wafer along the division lines;
• wherein
• the side of the wafer being opposite to the one side is mechanically partially cut with a first cutting width, and
• a remaining part of the wafer, in the thickness direction thereof in the region or regions where the partial cut or cuts had been formed, is mechanically cut and/or cut by laser and/or cut by plasma from the side of the wafer being opposite to the one side with a second cutting width,
• wherein the second cutting width is smaller than or equal to the first cutting width.