Method and system for cleaning wafer and scrubber

A method for cleaning a wafer, comprising:

• cleaning the wafer using a wafer scrubber;
• applying an agitated cleaning fluid on the wafer scrubber to clean the wafer scrubber, wherein the agitated cleaning fluid is provided with air bubbles and is agitated at an ultrasonic frequency;
• and
• cleaning the wafer or a second wafer by the wafer scrubber after the wafer scrubber is cleaned by the agitated cleaning fluid.

A system for cleaning a wafer, comprising:

• a wafer cleaning module configured to clean the wafer;
• and
• a scrubber cleaning module configured to clean a wafer scrubber used for cleaning the wafer, wherein the scrubber cleaning module comprises:
• a cleaning fluid supply configured to provide a cleaning fluid on the wafer scrubber;
• a gas supply configured to provide air bubbles to the cleaning fluid;
• an agitation generator configured to agitate the cleaning fluid;
• and
• a cleaning stage, wherein the wafer scrubber is moved relative to the cleaning stage when the wafer scrubber is cleaned by the scrubber cleaning module.