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US 2016/0254168 A1Published application
3D Shielding Case and Methods for Forming the Same
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsMonsen Liu, Chuei-Tang Wang, Lai Wei Chih, Chen-Hua Yu
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Abstract
A package includes a die, and a molding material molding the die therein. A metal shield case includes a first metal mesh over and contacting the molding material and the die, a second metal mesh underlying the die, and a Through-Assembly Via (TAV) in the molding material and forming a ring encircling the die. The TAV is electrically connected to the first metal mesh and the second metal mesh.
Claims20
A method comprising:
- molding a first die with a first molding material;
- forming Through-Assembly Vias (TAVs) in the first molding material wherein the TAVs comprises a TAV ring encircling the first die;
- and
- forming a first metal mesh and Under-Bump Metallurgies (UBMs) over and electrically coupled to the TAVs.
1 more element
A method comprising:
- encapsulating a first die within a molding material;
- forming first Through-Assembly Vias (TAVs) in the molding material wherein the TAVs comprises a TAV ring encircling and electrically coupled to the first die;
- and
- forming second TAVs in the molding material wherein the second TAVs are electrically isolated from the first TAVs;
- and
- forming a first metal mesh and Under-Bump Metallurgies (UBMs) over and electrically coupled to the second TAVs.
3 more elements
A method, comprising:
- encapsulating a die in a molding material;
- forming a first Through Assembly Via (TAV) in the molding material;
- forming a second TAV in the molding material, the second TAV being electrically isolated form the first TAV;
- and
- forming a first ground mesh over a first side of the molding material, the first ground mesh being electrically isolated from the first TAV and electrically connected to the second TAV.
2 more elements
Dependencies are inferred from the claim text.