Method of Manufacturing Semiconductor Device and Semiconductor Device

A semiconductor device, comprising:

• a semiconductor chip having a main surface, a back surface on the side opposite to the main surface, a plurality of first electrodes formed over the main surface, and a second electrode formed over the back surface;
• a chip mounting part having an upper surface and a lower surface on the side opposite to the upper surface;
• a bonding material electrically coupling the second electrode of the back surface of the semiconductor chip with the upper surface of the chip mounting part;
• and
• a plurality of leads electrically coupled with the first electrodes, respectively,
• wherein a recess is formed in a peripheral region of the back surface of the semiconductor chip,
• wherein the recess has a first surface extending to join the back surface, and a second surface located between the main surface and the back surface in a thickness direction of the semiconductor chip and extending to join the first surface, and
• wherein a metal film is formed over the first surface and the second surface of the recess.