Method of manufacturing silicon carbide semiconductor substrate and method of manufacturing silicon carbide semiconductor device
AssigneeSumitomo Electric Industries, Ltd.
InventorJun Genba
Life of this patent
Estimating the term…
Loading patent…
AssigneeSumitomo Electric Industries, Ltd.
InventorJun Genba
Estimating the term…
A step of preparing a silicon carbide substrate (S11), a step of forming a first silicon carbide semiconductor layer on the silicon carbide substrate using a first source material gas (S12), and a step of forming a second silicon carbide semiconductor layer on the first silicon carbide semiconductor layer using a second source material gas (S13) are provided. In the step of forming a first silicon carbide semiconductor layer (S12) and the step of forming a second silicon carbide semiconductor layer (S13), ammonia gas is used as a dopant gas, and the first source material gas has a C/Si ratio of not less than 1.6 and not more than 2.2, the C/Si ratio being the number of carbon atoms to the number of silicon atoms.
-4. (canceled)
A method of manufacturing a silicon carbide semiconductor substrate, comprising steps of:
Dependencies are inferred from the claim text.