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US 2016/0254128 A1Published application
Sputtering target and process for producing it
AssigneePlansee SE
InventorsNIKOLAUS REINFRIED, MICHAEL SCHOBER, WOLFRAM KNABL, JOERG WINKLER
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Abstract
A sputtering target is composed of an Mo alloy containing at least one metal of group 5 of the Periodic Table, where the average content of group 5 metal is from 5 to 15 at % and the Mo content is ≧80 at %. The sputtering target has an average C/O ratio in (at %/at %) of ≧1. The sputtering targets can be produced by shaping or forming and have an improved sputtering behavior.
Claims23
1-22. (canceled)
A sputtering target, comprising:
- an Mo alloy containing at least one metal of group 5 of the Periodic Table;
- an average content CM of the group 5 metal of from 5 to 15 at %;
- an Mo content of ≧80 at %;
- and
- an average CIO ratio of the sputtering target in (at %/at %) of ≧1.
2 more elements
A process for producing a sputtering target, the process comprising the following steps:
- a. producing a powder mixture having:
- i. ≧80 at % of Mo powder;
- ii. a powder of at least one group 5 metal having a content of group 5 metal in the powder mixture of from 5 to 15 at %;
- and
- iii. a C source having an amount of C being selected so that a total content of C ΣC in at % and a total content of O ΣO in at % in the powder mixture satisfies the following relationship:
- 0.2≦ΣC/ΣO≦1.2;
- and
- b. consolidating the powder mixture.
5 more elements
Dependencies are inferred from the claim text.