Three dimensional (3d) virtual image modeling method for object produced through semiconductor manufacturing process
AssigneeDaouincube, Inc.
InventorsTae Hwa LIM, Dong Wan KANG, Hyun Cheol KIM
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Abstract
A three dimensional (3D) virtual shape modeling method for an object produced through a semiconductor process is provided, which can model a 3D shape of an object produced through processes such as deposition, etching, and so on that are used in a semiconductor or planar display panel manufacturing process. Specifically, convenient modeling can be performed when forming a layer produced through deposition and then etching on a non-flat, preceding layer, by using two dimensional projection method.
Claims3
A three dimensional (3D) virtual image modeling method for an object produced through a semiconductor process, comprising:
- generating a planar projection diagram of an n-th layer based on a mask shape for the n-th layer to be stacked on an existent m-th layer;
- segmenting the projection diagram according to a shape of the m-th layer, by performing Boolean operation between the projection diagram and the m-th layer;
- and
- completing a virtual shape of the n-th layer which is 3D shape by applying a bend to the projection diagram according to the shape of the m-th layer, and expanding to a height of the n-th layer.
Dependencies are inferred from the claim text.