Back to results
US 2016/0252887 A1Published application
Substrate Unit, Timepiece, And Substrate Bonding Method
AssigneeCasio Computer Co., Ltd.
InventorKoji NAMIKI
Life of this patent
Estimating the term…
Abstract
A substrate unit includes a first substrate and a second substrate, the second substrate including a superimposed portion superimposed on at least part of the first substrate, and bonding portions located in a plurality of positions at least defining a plane in the superimposed portion, the bonding portions bonded to the first substrate.
Claims20
A substrate unit comprising:
- a first substrate;
- and
- a second substrate comprising a superimposed portion superimposed on at least part of the first substrate, and bonding portions bonded to the first substrate and located in a plurality of positions at least defining a plane in the superimposed portion.
A substrate bonding method comprising:
- bonding a first substrate to a second substrate comprising an superimposed portion superimposed on at least part of the first substrate, wherein
- the bonding comprises bonding the first substrate to the second substrate via bonding portions in a plurality of positions at least defining a plane in the superimposed portion.
Dependencies are inferred from the claim text.