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US 2016/0250830 A1Published application
Fluororesin base material, printed wiring board, and circuit module
AssigneesSumitomo Electric Printed Circuits, Inc., Sumitomo Electric Industries, Ltd.
InventorsSatoshi KIYA, Sumito UEHARA, Kousuke MIURA, Makoto NAKABAYASHI
Life of this patent
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Abstract
A fluororesin base material containing a fluororesin as a main component includes a modified layer on at least a partial region of a surface thereof, the modified layer containing a siloxane bond and a hydrophilic organofunctional group, and a surface of the modified layer having a contact angle of 90° or less with pure water.
Claims11
1:
- A fluororesin base material comprising a fluororesin as a main component, the fluororesin base material comprising:
- a modified layer on at least a partial region of a surface thereof,
- the modified layer containing a siloxane bond and a hydrophilic organofunctional group, and
- a surface of the modified layer having a contact angle of 90° or less with pure water.
1 more element
2:
- The fluororesin base material according to claim 1, wherein
- a peel strength of an epoxy resin adhesive having an average thickness of 25 m against the surface of the modified layer is 1.0 N/cm or more, as measured using a polyimide sheet having an average thickness of 12.5 μm as a flexible adherent.
3:
- The fluororesin base material according to claim 1, wherein
- the modified layer is not removed by an etching treatment in which the modified layer is immersed under conditions of 45° C. and 2 minutes, using an etchant containing iron chloride and having a specific gravity of 1.33 g/cm3 and a free hydrochloric acid concentration of 0.2 mol/L.
4:
- The fluororesin base material according to claim 1, wherein
- the surface of the modified layer has a mean surface roughness Ra of 4 μm or less.
5:
- The fluororesin base material according to claim 1, wherein
- the modified layer has an average thickness of 400 nm or less.
6:
- The fluororesin base material according to claim 1, wherein
- an optical transmittance at a wavelength of 600 nm is 50% or more.
7:
- The fluororesin base material according to claim 1, wherein
- the hydrophilic organofunctional group is a hydroxy group, a carboxy group, a carbonyl group, an amino group, an amide group, a sulfide group, a sulfonyl group, a sulfo group, a sulfonyldioxy group, an epoxy group, a methacryl group, a mercapto group, or a combination thereof.
8:
- A printed wiring board comprising the fluororesin base material according to claim 1.
9:
- The printed wiring board according to claim 8, wherein
- the printed wiring board includes a conductive pattern laminated on at least a portion of a region having the modified layer of the fluororesin base material.
10:
- The printed wiring board according to claim 8, wherein
- the printed wiring board includes a coating material laminated on the surface of the modified layer of the fluororesin base material.
11:
- A circuit module comprising the printed wiring board according to claim 8.