Loading patent…
AssigneesNorthrop Grumman Systems Corporation, The Board of Trustees of the Leland Stanford Junior University
InventorsJohn A. Starkovich, Edward M. Silverman, Jesse B. Tice, Hsiao-Hu Peng, Michael T. Barako, Kenneth E. Goodson
Estimating the term…
A thermally-conductive and mechanically-robust bonding method for attaching a metal nanowire (MNW) array to an adjacent surface includes the steps of: removing a template membrane from the MNW; infiltrating the MNW with a bonding material; placing the bonding material on the adjacent surface; bringing an adjacent surface into contact with a top surface of the MNW while the bonding material is bondable; and allowing the bonding material to cool and form a solid bond between the MNW and the adjacent surface. A thermally-conductive and mechanically-robust bonding method for attaching a metal nanowire (MNW) array to an adjacent surface includes the steps of: choosing a bonding material based on a desired bonding process; and without removing the MNW from a template membrane that fills an interstitial volume of the MNW, depositing the bonding material onto a tip of the MNW.
A thermally-conductive and mechanically-robust bonding method for attaching a metal nanowire (MNW) array to an adjacent surface, comprising the steps of:
A thermally-conductive and mechanically-robust bonding method for attaching a metal nanowire (MNW) array to an adjacent surface, comprising the steps of:
A metal nanowire (MNW) array attached at the MNW tips to an adjacent surface by mushroom-like caps of thermally-conductive and mechanically-robust bonding material.
A metal nanowire (MNW) array attached at the MNW tips to a continuous overplating layer of bonding material covering a template membrane.
Dependencies are inferred from the claim text.