Device for the Separate Application of Connecting Material Deposits

A device for the separate application of solder material deposits, said device comprising:

• a conveying device separately conveying the solder material deposits of a plurality of solder deposits from a solder material reservoir toward an application device, the conveying device having a plurality of transport holders formed as passage holes, each of said transport holders being movable from a receiving position P1 into a transfer position P2, in said receiving position P2, each transport holder receives a solder material deposit of said plurality of solder deposits from the solder material reservoir, in said transfer position P2, each transport holder deposits the solder material deposit received in the transport holder is exposed to a pressure gas and from which the solder material deposit received in the transport holder is transferred to the application device into an application position P3;
• and
• a removal device for removing the solder material deposit received in the transport holder from the transport holder arranged in a removal position P4 downstream of the transfer position in the conveying direction, the removal device being connected to a detector device triggering removal of the solder material deposit of the plurality of solder material deposits received in the transport holder, said detector device checking the condition of the transport holder in the transfer position.