Mold-Cooling System and Mold-Cooling Method
AssigneeKabushikikisha Matsui Seisakusho
InventorsMotoharu SHIMIZU, Jun KUDAMATSU
Life of this patent
Estimating the term…
Abstract
A mold-cooling system for cooling a heated mold by supplying cooling medium from a cooling medium supply source to a medium flow path provided for a mold. The mold-cooling system is characterized in that a discharge side path connected to an outlet side of the medium flow path of the mold is communicated with a heat exchanger condensing the cooling medium gasified and discharged from the medium flow path.
Claims12
A mold-cooling system for cooling a heated mold by supplying cooling medium from a cooling medium supply source to a medium flow path provided for a mold, wherein a discharge side path connected to an outlet side of the medium flow path of the mold is communicated with a heat exchanger condensing cooling medium gasified and discharged from the medium flow path.
The mold-cooling method for cooling a heated mold by supplying cooling medium to a medium flow path provided for a mold, wherein a discharge side path connected to an outlet side of the medium flow path of the mold is communicated with a heat exchanger, and cooling medium gasified and discharged from the medium flow path is condensed in the heat exchanger.
Dependencies are inferred from the claim text.