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US 2016/0250660 A1Published application
Assembly and method for transfer molding
AssigneeUnited Technologies Corporation
InventorDavid C. JARMON
Life of this patent
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Abstract
One exemplary embodiment of this disclosure relates to a transfer molding assembly including a chamber, a die within the chamber, a first gas control device configured to provide a first gas into the chamber, and a second gas control device configured to provide a second gas into the die.
Claims20
A transfer molding assembly, comprising:
- a chamber;
- a die within the chamber;
- a first gas control device configured to provide a first gas into the chamber;
- and
- a second gas control device configured to provide a second gas into the die.
2 more elements
A method comprising:
- providing a first gas into a chamber;
- and
- providing a second gas into a die within the chamber, the second gas having a different chemical composition than the first gas.
Dependencies are inferred from the claim text.