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US 2016/0243753 A1Published application
Pattern forming method and pattern forming apparatus
OwnerMasayuki HATANO, Yoshihisa KAWAMURAinventors
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Abstract
In a pattern forming method of an embodiment, a template pattern formed on a front side of a template is brought into contact with resist placed on a substrate. Moreover, in the pattern forming method, rear pressure being an ambient pressure on a back side of the template is adjusted to a second pressure. Moreover, in the pattern forming method, the resist is filled in the template pattern under the second pressure to be cured.
Claims20
A pattern forming method comprising:
- bringing a template pattern formed on a front side of a template into contact with resist placed on a substrate;
- adjusting, to a first pressure, pressure inside an apparatus on which the template is placed;
- adjusting, to a second pressure, rear pressure being ambient pressure on a back side of the template, the second pressure being lower than the first pressure;
- filling the resist in the template pattern under the second pressure;
- and
- curing the resist.
3 more elements
A pattern forming apparatus comprising:
- a contact processing unit that brings a template pattern formed on a front side of a template into contact with resist placed on a substrate, and fill the resist in the template pattern;
- a pressure adjustment unit that adjusts rear pressure being ambient pressure on a back side of the template;
- a curing processing unit that cures the resist;
- and
- a control unit that controls the pressure adjustment unit, wherein
- the control unit transmits, to the pressure adjustment unit, an instruction to adjust the rear pressure to a second pressure upon the filling.
3 more elements
Dependencies are inferred from the claim text.