Printed circuit board
AssigneeSamsung Electronics Co., Ltd.
InventorsSung-Won PARK, Dong-Kyun YU, Ji-Heon YU, Seung-Yup LEE, Taek-Kyun CHOI
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Abstract
Various embodiments related to a printed circuit board in which a capacitor is embedded are described. The capacitor may include: a plurality of first conductive layers that have a plurality of first via holes; a plurality of second conductive layers that have a plurality of second via holes, wherein the first and second conductive layers are alternately arranged in turns; and a plurality of dielectric layers that are arranged between the first and second conductive layers. Other various embodiments are possible.
Claims30
A printed circuit board on which a plurality of electronic components are mounted and in which a capacitor is embedded, the printed circuit board comprising:
- a plurality of first conductive layers that have a plurality of first via holes;
- a plurality of second conductive layers that have a plurality of second via holes, wherein the first and second conductive layers are alternately arranged in turns;
- and
- a plurality of dielectric layers that are arranged between the first and second conductive layers.
A printed circuit board on which a plurality of electronic components are mounted and in which a capacitor is embedded, the printed circuit board comprising:
- a plurality of first conductive layers that have a first plating part and are electrically connected to each other by the first plating part;
- a plurality of second conductive layers that have a second plating part and are electrically connected to each other by the second plating part, wherein the first and second conductive layers are alternately arranged in turns;
- and
- a plurality of dielectric layers that are arranged between the first and second conductive layers.
A printed circuit board on which a plurality of electronic components are mounted and in which a capacitor is embedded, the printed circuit board comprising:
- a plurality of first conductive layers that have a plurality of first via holes on one side thereof and have a plating part on an opposite side thereof;
- a plurality of second conductive layers that have a plurality of second via holes one side thereof, wherein the first and second conductive layers are alternately arranged in turns;
- and
- a plurality of dielectric layers that are arranged between the first and second conductive layers.
A printed circuit board on which a plurality of electronic components are mounted and in which a capacitor is embedded, the printed circuit board comprising:
- a plurality of first conductive layers that have a plurality of first via holes on one side thereof and have a plating part on an opposite thereof;
- a plurality of second conductive layers that have a plurality via holes on one side thereof;
- and
- a plurality of dielectric layers that are arranged between the first and second conductive layers, and
- wherein the first and second conductive layers are alternately arranged in turns or the first conductive layers are continuously arranged between the second conductive layer, and the first and second conductive layers are alternately arranged in turns or the second conductive layers are continuously arranged between the first conductive layer.
A printed circuit board on which a plurality of electronic components are mounted and in which a capacitor is embedded, the printed circuit board comprising:
- a plurality of first conductive layers;
- a plurality of second conductive layers;
- and
- a plurality of dielectric layers that are arranged between the first and second conductive layers, and
- wherein the first and second conductive layers are alternately arranged in turns or the first conductive layers are continuously arranged between the second conductive layer, and the first and second conductive layers are alternately arranged in turns or the second conductive layers are continuously arranged between the first conductive layer.
Dependencies are inferred from the claim text.