Wiring board, and mounting structure and laminated sheet using the same

A wiring board, comprising:

• a first resin layer;
• an inorganic insulating layer disposed on the first resin layer;
• a second resin layer disposed on the inorganic insulating layer;
• and
• a conductive layer disposed on the second resin layer, the inorganic insulating layer containing
• a plurality of first inorganic insulating particles partly connected to each other and having a particle diameter of not less than 3 nm and not more than 15 nm;
• a plurality of second inorganic insulating particles existing with the first inorganic insulating particles in between and having a particle diameter of not less than 35 nm and not more than 110 nm;
• and
• a resin portion disposed in a gap between the plurality of first inorganic insulating particles, and
• the inorganic insulating layer having a first region located in a vicinity of the second resin layer and a second region located on a side opposite to a second resin layer side of the first region, and
• a content ratio of the second inorganic insulating particles in the first region being lower than a content ratio of the second inorganic insulating particles in the second region.