Printed circuit board and manufacturing method thereof
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorsJae-Ean LEE, Jee-Soo MOK, Young-Gwan KO, Soon-Oh JUNG, Kyung-Hwan KO, Yong-Ho BAEK
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Abstract
A printed circuit board and method of manufacturing the same are provided. The printed circuit board includes a first substrate including a first insulation layer and a first circuit layer including a bonding pad, the bonding pad disposed on the first insulation layer, a second substrate disposed on the first substrate and having a cavity exposing the bonding pad to an outside, and a dam disposed between the bonding pad and an inner wall of the cavity.
Claims18
A printed circuit board, comprising:
- a first substrate comprising a first insulation layer and a first circuit layer, the first circuit layer comprising a bonding pad disposed on the first insulation layer;
- a second substrate disposed on the first substrate and having a cavity exposing the bonding pad to an outside;
- and
- a dam disposed between the bonding pad and an inner wall of the cavity.
A method of manufacturing a printed circuit board, the method comprising:
- forming a first substrate comprising an first insulation layer and a first circuit layer, the first circuit layer comprising a bonding pad disposed on the first insulation layer;
- forming a dam on a side surface of the bonding pad;
- forming a barrier on the dam and the bonding pad that is exposed to an outside;
- forming a second substrate having a cavity on the first substrate;
- and
- removing the barrier.
Dependencies are inferred from the claim text.