Circuit assembly

Abstract

Provided is a circuit assembly having a new structure in which a busbar circuit unit overlapped with a printed circuit board can reliably be fixed regardless of the heating temperature at the time of soldering of an electrical component. In a circuit assembly in which a busbar circuit unit constituted by a plurality of busbars is overlapped with a printed circuit board having a printed wiring and is fixed thereto via an adhesive sheet, the plurality of busbars are adhered to the surface of the adhesive sheet in a state in which the busbars are arranged adjacently and spaced apart by gaps, and the gaps between the busbars are filled with the adhesive agent. With the adhesive agent, press-cut surfaces of the busbars and at least one of the adhesive sheet and the printed circuit board that is exposed from the gaps between the busbars is adhered.

Dependencies are inferred from the claim text.