Compact camera module arrangements that facilitate dam-and-fill and similar encapsulation techniques

A compact camera module comprising:

• a stack of one or more optical elements;
• an optically transmissive substrate wherein the stack of one or more optical elements is attached to a first side of the transmissive substrate;
• an image sensor mounted on a support, wherein the optically transmissive substrate is separated from the image sensor by a first spacer attached to a second side of the transmissive substrate;
• and
• a second spacer attached to the transmissive substrate at or near a periphery of the transmissive substrate, wherein the second spacer extends from the transmissive substrate toward, but does not reach, the support on which the image sensor is mounted;
• wherein the optically transmissive substrate includes a middle section that has a first thickness, the substrate further including a second section near its periphery wherein the second section has a second thickness that is less than the first thickness,
• the camera module further including wires electrically coupling the image sensor to the support on which the image sensor is mounted, wherein one or more of the wires are located in a space that is between the first and second spacers and that is below the second section of the optically transmissive substrate.

A compact camera module comprising:

• a stack of one or more optical elements;
• an optically transmissive substrate wherein the stack of one or more optical elements is attached to a first side of the transmissive substrate;
• an image sensor mounted on a support, wherein the optically transmissive substrate is separated from the image sensor by a first spacer attached to a second side of the transmissive substrate;
• and
• wherein the optically transmissive substrate includes a middle section that has a first thickness, the substrate further including a second section adjacent its periphery wherein the second section has a second thickness that is less than the first thickness,
• the camera module further including:
• wires electrically coupling the image sensor to a printed circuit board substrate on which the image sensor is mounted, wherein one or more of the wires is connected to a portion of the image sensor located below the second section of the optically transmissive substrate;
• and
• an encapsulant covering the wires.