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US 2016/0240813 A1Published application
Electronic component and method for producing an electronic component
AssigneeOSRAM OLED GmbH
InventorsPhilipp SCHWAMB, Simon SCHICKTANZ
Life of this patent
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Abstract
The invention relates to an electronic component (1) with a substrate (2), on which an organic electronic functional area (3) is arranged, and a cover (4) which extends over the electronic functional area. Said cover is connected to the substrate by means of an electrically conductive solder layer (5). The invention also relates to a method for producing an electronic component.
Claims19
An electronic component comprising
- a substrate, on which an organic electronic functional region is arranged, and
- a cover extending over the electronic functional region, wherein
- the cover is connected to the substrate by means of an electrically conductive solder layer.
A method for producing an electronic component, comprising the following steps:
- providing a substrate, on which an organic electronic functional region is arranged;
- providing a cover;
- arranging the cover and the substrate relative to one another in such a way that the cover extends over the electronic functional region and an interspace is formed between the substrate and the cover;
- introducing a liquid solder material into the interspace, such that the interspace is filled with liquid solder material in places;
- hardening the solder material in order to form a solder layer, by means of which the cover is connected to the substrate;
- completing the component.
3 more elements
An electronic component comprising
- a substrate, on which an organic electronic functional region is arranged, and
- a cover extending over the electronic functional region, wherein
- the cover is connected to the substrate by means of an electrically conductive solder layer,
- between the solder layer and the cover or
- between the solder layer and the substrate,
- a connection layer is arranged, to which the solder layer is connected,
- the solder material of the solder layer connects with the connection layer better than with the material that is offered on that side of the connection layer which faces away from the solder layer, and
- the connection layer extends over the electronic functional region.
5 more elements
An electronic component comprising
- a substrate, on which an organic electronic functional region is arranged, and
- a cover extending over the electronic functional region, wherein the cover is connected to the substrate by means of an electrically conductive solder layer, and wherein the electrically conductive solder layer participates in the electrical contacting of the electronic component.
Dependencies are inferred from the claim text.