Oled package device and package method of oled panel

An OLED package device, comprising:

• a base body, a lower stage installed on the base body and a heating device installed between the base body and the lower stage, and the lower stage is employed to load a package plate, and the heating device can heat the lower stage, and the lower stage passes heat to the package plate for heating up the package plate;
• the heating device starts to heat as implementing as extracting air;
• the heating device heats for heating up the package plate;
• the temperature of the package plate is controlled in a range of 30-50° C.;
• the heating device stops heating when an OLED substrate and the package plate are being laminated.

A package method of an OLED panel, comprising steps of:

• step 1, providing the OLED substrate and a package substrate, and the package substrate comprises a seal frame, and underfill in the seal frame;
• step 2, delivering the OLED substrate and the package substrate to a package stage and implementing air extraction;
• step 3, heating up the package substrate;
• step 4, aligning the OLED substrate and the package substrate;
• step 5, laminating the OLED substrate and the package substrate;
• step 6, stopping heating the package substrate;
• step 7, charging air and drawing out the OLED substrate and the package substrate which have been laminated;
• step 8, solidifying the seal frame and the underfill.