Frame based package for flip-chip led

A frame structure comprising:

• a frame that includes a plurality of openings,
• a plurality of light emitting chips that are situated in the plurality of openings, each of the light emitting chips including:
• a substrate upon which a light emitting element is situated and through which light from the light emitting element is emitted, and
• contact pads that are formed on a first surface of the light emitting element that is opposite the substrate;
• wherein each of the openings includes a cap, wherein the cap is in direct contact with the light emitting chip,
• wherein each of the openings includes walls that surround the light emitting chip within the opening and allow external contact directly to the contact pads and allow light from the substrate to exit the frame structure.

A method of forming light emitting devices comprising:

• providing a frame structure that includes a plurality of openings;
• placing a light emitting chip within each of the openings;
• each of the light emitting chips including:
• a substrate upon which a light emitting element is situated and through which light from the light emitting element is emitted, and
• contact pads that are formed on a surface of the light emitting element that is opposite the substrate;
• placing a cap within each of the openings, wherein the cap is in direct contact with the light emitting chip;
• and
• slicing the frame structure to provide individual light emitting modules that include one or more light emitting devices that are enclosed within walls of each opening that surround the light emitting chip within the opening and allow external contact directly to the contact pads and allow light from the substrate to exit the frame structure.