Semiconductor device
AssigneeRenesas Electronics Corporation
InventorsNaoya INOUE, Kishou KANEKO, Yoshihiro HAYASHI
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AssigneeRenesas Electronics Corporation
InventorsNaoya INOUE, Kishou KANEKO, Yoshihiro HAYASHI
Estimating the term…
The present invention makes it possible to lower the on resistance of a semiconductor element without hindering the function of a diffusion prevention film in a semiconductor device having the semiconductor element that uses a wire in a wiring layer as a gate electrode and has a gate insulation film in an identical layer to the diffusion prevention film. A first wire and a gate electrode are embedded into the surface layer of an insulation layer comprising a first wiring layer. A diffusion prevention film is formed between the first wiring layer and a second wiring layer. A gate insulation film is formed by: forming a recess over the upper face of the diffusion prevention film in the region overlapping with the gate electrode and around the region; and thinning the part.
A semiconductor device, comprising:
Dependencies are inferred from the claim text.