Package method of substrate and package sturcture

A package method of a substrate, comprising steps of:

• step 1, providing the substrate and a package plate, and the package plate comprises a spreading surface;
• step 2, forming at least one groove in a spreading path of a frame on the spreading surface of the package plate;
• step 3, spreading seal glue on the spreading surface of the package plate to form the continuous frame, and a recess is formed in the frame corresponding to the at least one groove;
• step 4, positioning underfill inside an area surrounded by the frame on the spreading surface of the package plate;
• step 5, oppositely fitting the substrate and the package plate, and an air outlet is formed at a position of the recess of the frame between the substrate and the package plate;
• step 6, extracting air between the substrate and the package plate through the air outlet;
• step 7, laminating the substrate and the package plate;
• step 8, irradiating and solidifying the seal glue and the underfill with UV light to accomplish packaging the substrate with the package plate.