Multi-function miniaturized surface-mount device and process for producing the same

A process for producing a multi-function surface-mount device, comprising the steps of:

• 1) preforming a die having a lower electrode at its bottom and an upper electrode at its top;
• wherein the die is one selected from the group consisting of a TVS diode, a Schottky diode, a switch diode, a Zener diode, a rectifier diode, a varistor chip, a capacitor chip, a resistor chip, an inductor chip, a fuse chip, a PTC chip thermistor and an NTC chip thermistor;
• 2) using a single die of Step 1), or connecting at least two dies of Step 1) in series, in parallel or in any combination of series and parallel, to make a die module, wherein the bottom of the die module has at least one first electrode, and the top of the die module has at least one second electrode;
• 3) preforming a lower circuit board having a circuit electrode at its surface, and preforming an upper circuit board having a circuit electrode at its surface;
• wherein the lower circuit board or the upper circuit board is made of a ceramic substrate, a plastic substrate, a composite substrate or a heat-dissipating substrate;
• 4) printing, applying or dispensing lead-free conductive paste onto the circuit electrode of the lower circuit board of Step 3);
• 5) connecting the first electrode of the die module of Step 2) to the circuit electrode of the lower circuit board by means of the lead-free conductive paste;
• 6) printing, applying or dispensing lead-free conductive paste onto the second electrode of the die module of Step 5);
• 7) connecting the circuit electrode of the upper circuit board of Step 3) to the second electrode of the corresponding die module of Step 6) by means of the lead-free conductive paste;
• 8) performing packaging by filling an insulating material between the lower circuit board and the upper circuit board of Step 7);
• 9) performing cutting along a preset cutting line so as to obtain two semi-finished electronic devices having the circuit electrodes;
• and
• 10) making outer electrodes at two lateral ends of the semi-finished electronic device of Step 9) by applying silver coating or film processing, wherein each outer electrode is in electrical connection with its own corresponding circuit electrodes, respectively, thereby the multi-function surface-mount device is obtained.