Semiconductor Device and Method of Manufacturing the Same

A method of manufacturing a semiconductor device, the method comprising:

• (a) preparing a semiconductor substrate which includes a plurality of wiring layers and a pad formed on an uppermost wiring layer of the plurality of wiring layers;
• (b) forming a surface protection film which includes an opening on the pad and is made of an inorganic insulating film;
• (c) forming a rewiring, which is electrically connected to the pad via the opening, on the surface protection film;
• (d) forming a pad electrode on the rewiring;
• and
• (e) forming a ball at a tip end of a wire, and connecting the ball to the pad electrode while applying ultrasonic vibration to the ball in a first direction,
• wherein the rewiring includes a pad electrode mounting portion on which the pad electrode is mounted, a connection portion which is connected to the pad, and an extended wiring portion that couples the pad electrode mounting portion and the connection portion, and
• the pad electrode mounting portion has a rectangular shape with long sides and short sides.