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US 2016/0240492 A1Published application
Antenna on ceramics for a packaged die
AssigneeIntel Corporation
InventorsAndreas Wolter, Saravana Maruthamuthu, Mikael Knudsen, Meyer Thorsten, Georg Seidemann, Pablo Herrero, Pauli Jaervinen
Life of this patent
Estimating the term…
Abstract
An antenna is described on ceramics that may be used for a packaged die. In one example, a package has a die, a ceramic substrate over the die, an antenna attached to the ceramic substrate, and conductive leads electrically connecting the antenna to the die.
Claims21
-21. (canceled)
A package comprising:
- a die;
- a ceramic substrate over the die;
- an antenna attached to the ceramic substrate;
- and
- conductive leads electrically connecting the antenna to the die.
2 more elements
A computing system comprising:
- a processor;
- a user interface;
- and
- a communications chip in a package, the package having a die, a ceramic substrate over the die, an antenna attached to the ceramic substrate, a mold compound over the ceramic substrate and the die, a redistribution layer formed on a front side of the die and on the mold compound and conductive leads electrically connecting the antenna to the redistribution layer.
1 more element
A method comprising:
- attaching an antenna to a ceramic substrate;
- attaching the ceramic substrate to a die;
- forming a cover over the die;
- forming a redistribution layer over the cover and the die;
- and
- electrically connecting the antenna to the die through the redistribution layer.
3 more elements
Dependencies are inferred from the claim text.