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US 2016/0240465 A1Published application
Reducing Cracking by Adjusting Opening Size in Pop Packages
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorHsien-Wei Chen
Life of this patent
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Abstract
A package includes a device die, a molding material molding the device die therein, and a surface dielectric layer at a surface of the package. A corner opening is in the surface dielectric layer. The corner opening is adjacent to a corner of the package. An inner opening is in the surface dielectric layer. The inner opening is farther away from the corner of the package than the corner opening. The corner opening has a first lateral dimension greater than a second lateral dimension of the inner opening.
Claims20
A package comprising:
- a first package comprising:
- a device die;
- a molding material molding the device die therein;
- a surface dielectric layer at a surface of the first package;
- a corner opening in the surface dielectric layer, wherein the corner opening is adjacent to a corner of the first package;
- and
- an inner opening in the surface dielectric layer, wherein the inner opening is farther away from the corner of the first package than the corner opening, and the corner opening has a first lateral dimension greater than a second lateral dimension of the inner opening.
4 more elements
A package comprising:
- a first package comprising:
- a device die;
- a molding material molding the device die therein;
- a surface dielectric layer at a surface of the first package;
- a corner opening in the surface dielectric layer, wherein the corner opening is proximal a corner of the first package and has a first lateral dimension;
- and
- an inner opening in the surface dielectric layer, wherein the inner opening is distal the corner of the first package than the corner opening, and the inner opening has a second lateral dimension;
- a second package comprising:
- a first conductive feature having a third lateral dimension;
- and
- a second conductive feature having a fourth lateral dimension, wherein a first ratio of the first lateral dimension to the third lateral dimension is greater than a second ratio of the second lateral dimension to the fourth lateral dimension;
- a corner solder region bonded to the first conductive feature, extending into the corner opening, and in contact with the first conductive feature;
- and
- an inner solder region bonded to the second conductive feature, extending into the inner opening, and in contact with the second conductive feature.
11 more elements
A package comprising:
- a device die;
- a molding material encapsulating the device die therein;
- and
- a first through-via and a second through-via penetrating through the molding material, wherein the first through-via has a first lateral dimension greater than a second lateral dimension of the second through-via.
1 more element
Dependencies are inferred from the claim text.