Hybrid circuit board and method for making the same, and semiconductor package structure

A semiconductor package structure comprising:

• a hybrid circuit board, comprising:
• an insulated molding layer comprising a first surface and a second surface opposite to the first surface;
• a solder mask layer formed on the first surface of the insulated molding layer;
• a conductive patterned layer formed on the first surface of the insulated molding layer and embedded in the solder mask layer, the thickness of the solder mask layer is equivalent to the thickness of the conductive patterned layer;
• a plurality of conductive pillars embedded in the insulated molding layer, each of conductive pillars has a first end electrically connected to the conductive patterned layer, and a second end exposed to the second surface of the insulated molding layer;
• and
• a supporting plate positioned on the solder mask layer and the conductive patterned layer, the supporting plate has an opening to partially expose the solder mask layer and the conductive patterned layer;
• and
• a semiconductor chip bonded on the opening which is corresponding to the exposed portions of the solder mask layer and the conductive patterned layer, the semiconductor chip is electrically connected to the conductive patterned layer,
• wherein the thermal expansion coefficient of the insulated molding layer is equivalent to the thermal expansion coefficient of the semiconductor chip.

A method of manufacturing a hybrid circuit board comprising the steps of :

• providing a supporting plate;
• forming a solder mask layer on part of an end surface of the supporting plate;
• forming a conductive patterned layer on the end surface of the supporting plate, the conductive patterned layer is formed on the end surface of the supporting plate without covering the solder mask layer, the thickness of the solder mask layer is equivalent to the thickness of the conductive patterned layer;
• forming a plurality of conductive pillars on the surface of the conductive patterned layer, each of conductive pillars has a first end to electrically connect with the conductive patterned layer, and a second end opposite to the first end;
• forming an insulated molding layer on the surfaces of the supporting plate with the solder mask layer and the conductive patterned layer, the conductive pillars are embedded in the insulated molding layer, and the second end for each of conductive pillars related to the insulated molding layer is exposed;
• and
• etching the supporting plate to form an opening for exposing partially the solder mask layer and the conductive patterned layer.