Systems, apparatus, and methods for heat dissipation

A semiconductor package, comprising:

• a heat spreader having a bottom side and a perimeter;
• an outer perimeter portion attached to the bottom side of the heat spreader along the perimeter of the heat spreader, the outer perimeter portion having a plurality of electrical pathways therein;
• an inner portion attached to the bottom side of the heat spreader, the inner portion having a plurality of electrical pathways therein;
• a package substrate located below and spaced from the outer perimeter portion, the package substrate having a plurality of electrical pathways therein;
• a plurality of connection points located between the outer perimeter portion and the package substrate, the plurality of connection points coupling the plurality of electrical pathways of the outer perimeter portion to the plurality of electrical pathways of the package substrate;
• and
• wherein the outer perimeter portion and the inner portion form a first cavity on the bottom side of the heat spreader and a second cavity on the bottom side of the heat spreader horizontally adjacent the first cavity and spaced therefrom.

A heat spreader, comprising:

• a first portion having a bottom side and a perimeter;
• an outer perimeter portion attached to the bottom side of the first portion along the perimeter of the first portion, the outer perimeter portion having a plurality of electrical pathways therein;
• a plurality of connection points located on a bottom side of the outer perimeter portion opposite the first portion, the plurality of connection points being coupled to the plurality of electrical pathways of the outer perimeter portion and providing an external connection;
• and
• wherein the outer perimeter portion forms a cavity on the bottom side of the first portion.

A heat spreader, comprising:

• a first portion having a bottom side and a perimeter;
• an outer perimeter portion attached to the bottom side of the first portion along the perimeter of the first portion, the outer perimeter portion having a plurality of electrical pathways therein;
• an inner portion attached to the bottom side of the first portion, the inner portion having a plurality of electrical pathways therein;
• a plurality of connection points located between the outer perimeter portion and a package substrate, the plurality of connection points coupling the plurality of electrical pathways of the outer perimeter portion to a plurality of electrical pathways in the package substrate;
• and
• wherein the outer perimeter portion and the inner portion form a first cavity on the bottom side of the first portion and a second cavity on the bottom side of the first portion horizontally adjacent the first cavity and spaced therefrom.