RF Package
AssigneeAmpleon Netherlands B.V.
InventorChristian Weinschenk
Life of this patent
Estimating the term…
Abstract
An example package comprising: an RF circuit having a first portion and a second portion; a cavity structure positioned only over the first portion of the RF circuit; and an encapsulant material coupled to cover the RF circuit and cavity structure on at least one side of the RF circuit. An example method of package manufacture, comprising: identifying an RF circuit; forming a cavity structure upon the RF circuit, wherein at least a portion of the cavity structure has a height based on a level of magnetic field in the RF circuit; and covering the RF circuit and cavity structure with an encapsulant material on at least one side of the RF circuit.
Claims16
A package comprising:
- an RF circuit having a first portion and a second portion;
- a cavity structure positioned only over the first portion of the RF circuit;
- and
- an encapsulant material coupled to cover the RF circuit and cavity structure on at least one side of the RF circuit.
A method of package manufacture, comprising:
- identifying an RF circuit;
- forming a cavity structure upon the RF circuit, wherein at least a portion of the cavity structure has a height based on a level of magnetic field in the RF circuit;
- and
- covering the RF circuit and cavity structure with an encapsulant material on at least one side of the RF circuit.
Dependencies are inferred from the claim text.