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US 2016/0240445 A1Published application
Method for Positioning a Carrier with Electronic Components and Electronic Component Produced with Such Method
AssigneeBesi Netherlands B.V.
InventorsJurgen Hendrikus Gerhardus Huisstede, Mark Hermans
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Abstract
The present invention relates to a method of processing a solder masked carrier with electronic components, comprising the detection of a carrier related reference and the detection of a solder mask dependent reference, which detected reference are used for processing the position of the solder mask on the carrier. The invention also relates to an electronic component as produced with such method.
Claims11
A method of processing a solder masked carrier with electronic components, comprising the method steps:
- A) detecting at least one carrier related reference;
- B) processing the at least one detected carrier related reference into a position of the carrier;
- C) detecting a least one solder mask dependent reference;
- D) processing the at least one detected solder mask dependent reference into a position of the solder mask on the carrier;
- and
- E) processing the solder masked carrier with electronic components dependent on at least the position of the solder mask on the carrier
- wherein the processing of the solder masked carrier with electronic components according step E) comprises the separation of the solder masked electronic components.
4 more elements
Dependencies are inferred from the claim text.