Method and Apparatus for Planarizing Material Layers

Abstract

A processing chamber is disclosed for planarizing material layers (for example, polymer layers). An exemplary processing chamber includes a substrate table configured to support a substrate having a material layer formed thereover and a flattening structure having a substantially flat surface. The flattening structure moves freely with respect to a non-uniform surface of the material layer, such that the non-uniform surface is flattened as the substantially flat surface contacts the non-uniform surface. In some implementations, the processing chamber further includes a pressing mechanism operatively coupled to the flattening structure, and a pivotal interface coupling the flattening structure to the pressing mechanism. The pressing mechanism presses the substantially flat surface of the flattening structure to the non-uniform surface of the material layer, and the pivotal interface allows the flattening structure to pivot with respect to the pressing mechanism and with respect to the substrate.

Dependencies are inferred from the claim text.