Package Structures and Method of Forming the Same

A method comprising:

• at least laterally encapsulating a die with an encapsulant, the die being in a package component region, a scribe line region being along an edge of the package component region;
• forming a redistribution structure on the die and the encapsulant in the package component region, the forming the redistribution structure comprising:
• depositing a first dielectric material on the die and the encapsulant,
• patterning the first dielectric material into a first dielectric layer in the package component region and a first dummy block in the scribe line region, a separation region being disposed between the first dummy block and the first dielectric layer,
• forming a metallization pattern on the first dielectric layer, the metallization pattern being electrically coupled to the die,
• depositing a second dielectric material on the metallization pattern and the first dielectric layer, and
• patterning the second dielectric material into a second dielectric layer in the package component region and on the metallization pattern and the first dielectric layer;
• and
• forming external electrical connectors on the redistribution structure.

A structure comprising:

• a package region comprising:
• a die,
• an encapsulant at least laterally encapsulating the die, and
• a redistribution structure on a first side of the encapsulant and the die, the redistribution structure comprising a first dielectric layer, a second dielectric layer, and a metallization pattern between the first dielectric layer and the second dielectric layer, the metallization pattern being electrically coupled to the die;
• and
• a periphery region along an edge of the package region, the periphery region comprising a first dummy block portion on the first side of the encapsulant, the first dummy block portion being separated a distance from the first dielectric layer and the second dielectric layer.