Physical vapor deposition system and physical vapor depositing method using the same

A physical vapor deposition system, comprising:

• a chamber;
• a cover plate disposed on the chamber for holding a target;
• a pedestal disposed in the chamber for supporting a wafer;
• and
• a collimator disposed between the cover plate and the pedestal, wherein the collimator comprises:
• a plurality of sidewall sheets together forming a plurality of passages, wherein at least one of the passages has an entrance facing the cover plate and an exit facing the pedestal, a cross-sectional area of one of the passages at the entrance is larger than a cross-sectional area of the passage at the exit.

A method for physical vapor depositing a wafer, comprising:

• disposing a target to a cover plate which disposed on a chamber;
• disposing the wafer on a pedestal in the chamber;
• mounting and orienting a collimator in the chamber, wherein the collimator comprises:
• a plurality of sidewall sheets together forming a plurality of passages, wherein at least one of the passages has an entrance facing the cover plate and an exit facing the pedestal, a thickness of one of the sidewall sheets at the entrance is thinner than a thickness of the sidewall sheet at the exit;
• and
• dislodging atoms from the target, such that the atoms are deposited on the wafer after being filtered by the collimator.