Chip scale sensing chip package and a manufacturing method thereof

A method of manufacturing a chip scale sensing chip package module, comprising the steps of:

• providing a plurality of chip scale sensing chips, each chip scale sensing chip comprising a first top substrate and a first bottom substrate opposite to the first top substrate, wherein the sensing chip has a sensing device and a plurality of conductive pads adjacent to the first top substrate, and a plurality of conductive structures connected to the conductive pads by a re-distribution layer adjacent to the first bottom surface;
• providing a touch plate wafer having a color layer and a plurality of bonding areas spaced with scribing lines, and each of the bonding areas having a base and a spacer formed on the base, wherein the spacer has a cavity with a bottom wall exposing part of the surface of the base and a side wall surrounding the bottom wall;
• and
• providing a first adhesive layer to join the first top surface of each sensing chip to the bottom wall of each cavity and surround each sensing chip by each side wall of the cavities;
• applying a scribing process along the scribing lines to generate a plurality of chip scale sensing chip package;
• and
• providing a print circuit board. and bonding one of the chip scale sensing chip packages to the print circuit board by the conductive structures.