Signal count reduction between semiconductor dies assembled in wafer-level package
AssigneeMediatek Inc.
InventorYao-Chun Su
Life of this patent
Estimating the term…
Abstract
A semiconductor die assembled in a wafer-level package includes a processing circuit, a multiplexer, and a transmit interface. The processing circuit generates a plurality of signal outputs. The multiplexer multiplexes the signal outputs into a multiplexed signal. The transmit interface transmits the multiplexed signal to another semiconductor die assembled in the wafer-level package.
Claims25
A semiconductor die assembled in a wafer-level package, comprising:
- a processing circuit, arranged to generate a plurality of signal outputs;
- a multiplexer, arranged to multiple the signal outputs into a multiplexed signal;
- and
- a transmit interface, arranged to transmit the multiplexed signal to another semiconductor die assembled in the wafer-level package.
A semiconductor die assembled in a wafer-level package, comprising:
- a processing circuit, comprising:
- a plurality of processing modules, arranged to generate a plurality of signal outputs, respectively;
- an arbiter, arranged to perform arbitration upon transmission requests issued from the processing modules and generate an arbitrated signal according to one of the signal outputs;
- and
- a transmit interface, arranged to transmit the arbitrated signal to another semiconductor die assembled in the wafer-level package.
A semiconductor die assembled in a wafer-level package, comprising:
- a processing circuit, arranged to generate a first signal output in a first signal waveform;
- an encoder, arranged to encode the first signal output to generate a second signal output in a second signal waveform, wherein the second signal waveform is different from the first signal waveform;
- and
- a transmit interface, arranged to transmit the second signal output to another semiconductor die assembled in the wafer-level package.
A semiconductor die assembled in a wafer-level package, comprising:
- a receive interface, arranged to receive a multiplexed signal generated from another semiconductor die assembled in the wafer-level package;
- a demultiplexer, arranged to demultiplex the multiplexed signal into a plurality of signal inputs;
- and
- a processing circuit, arranged to receive the signal inputs from the demultiplexer.
A semiconductor die assembled in a wafer-level package, comprising:
- a receive interface, arranged to receive an arbitrated signal generated from another semiconductor die assembled in the wafer-level package;
- a processing circuit, comprising:
- at least one processing module;
- and
- a dispatcher, arranged to dispatch the arbitrated signal to the at least one processing module.
A semiconductor die assembled in a wafer-level package, comprising:
- a receive interface, arranged to receive a second signal input in a second signal waveform from another semiconductor die assembled in the wafer-level package;
- a decoder, arranged to decode the second signal input to generate a first signal input in a first signal waveform, wherein the second signal waveform is different from the first signal waveform;
- and
- a processing circuit, arranged to receive the first signal input.
Dependencies are inferred from the claim text.