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US 2016/0237573 A1Published application
Method for enhancing bond strength through in-situ peening
AssigneeUnited Technologies Corporation
InventorsAaron T. Nardi, Tahany Ibrahim El-Wardany, William Werkheiser, Michael A. Klecka
Life of this patent
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Abstract
One embodiment includes a method for enhancing bond strength between a powder deposit and a substrate. Powder is deposited on the substrate. Powder is shot peened with peening media that is harder than both the powder and the substrate to produce bond strength between the powder and the substrate that is at least twice bond strength between the powder and the and peening material substrate without shot peening.
Claims20
A method comprising:
- depositing a powder on a substrate to form a coating;
- and
- shot peening the coating with a peening media that is harder than both the coating and the substrate to produce a bond strength between the coating and the substrate that is at least twice a bond strength between the coating and the substrate without shot peening.
A method comprising:
- (a) depositing a powder on a substrate to form a coating layer;
- and
- (b) shot peening the coating layer with a peening media that is at least 1.5 times a hardness of the coating layer to cause an increase in deification of the coating layer.
An article comprising:
- a substrate;
- and
- a coating formed by powder deposited on the substrate, wherein a bond strength between the coating and the substrate is at least 50% of the lesser of a strength of the coating and a strength of the substrate.
Dependencies are inferred from the claim text.