Coating substrate using bernoulli atomic-layer deposition
AssigneeEastman Kodak Company
InventorsKurt D. Sieber, Kam Chuen Ng, Ronald Steven Cok
Life of this patent
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AssigneeEastman Kodak Company
InventorsKurt D. Sieber, Kam Chuen Ng, Ronald Steven Cok
Estimating the term…
A method for depositing a thin film on a moveable substrate using atmospheric pressure atomic-layer deposition provides a chamber including a stationary support, through which fluid flows, that supports a moveable substrate. A moveable substrate includes a levitation stabilizing structure on the substrate that defines an enclosed interior impingement area of the substrate. The moveable substrate is positioned proximate to the stationary support so that the stationary support extends beyond the enclosed interior impingement area and the fluid flow is directed within the enclosed interior impingement area of the moveable substrate. A fluid flow, provided from a pressurized-gas source through the stationary support, impinges on the moveable substrate surface within the enclosed interior impingement area to levitate and expose the moveable substrate to the fluid while restricting the lateral motion of the moveable substrate with the levitation stabilizing structure to deposit a thin film on the moveable substrate.
A method for depositing a thin film on a moveable substrate using atmospheric pressure atomic-layer deposition, comprising:
A method for fluidically levitating a moveable substrate comprising:
Dependencies are inferred from the claim text.