Resin composition for printed circuit board, insulating film, and printed circuit board using the same
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorsGeum-Hee YUN, Dae-Hui JO, Seong-Hyun YOO, Keung-Jin SOHN, Jin-Young KIM
Life of this patent
Estimating the term…
Abstract
A resin composition for a printed circuit includes a first resin having a polycyclic group; a second resin having an imide group conjugated to at least one cyclic group; and a hardening accelerator having two or more functional groups, wherein the resin composition does not include a hardening agent.
Claims18
A resin composition for a printed circuit board, the resin composition comprising:
- a first resin comprising a polycyclic group;
- a second resin comprising an imide group conjugated to at least one cyclic group;
- and
- a hardening accelerator comprising two or more functional groups,
- wherein the resin composition does not include a hardening agent.
An insulating film for a printed circuit board, the insulating film being formed using a resin composition comprising:
- a resin comprising a polycyclic group;
- a resin comp rising an imide group conjugated to at least one cyclic group;
- and
- a hardening accelerator comprising two or more functional groups,
- wherein the resin composition does not include a hardening agent.
A printed circuit board comprising an insulating film formed by using a resin composition for a printed circuit board, wherein the resin composition comprises:
- a resin comprising a polycyclic group;
- a resin comprising an imide group conjugated to at least one cyclic group;
- and
- a hardening accelerator having two or more functional groups,
- wherein the resin composition does not include a hardening agent.
Dependencies are inferred from the claim text.