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US 2016/0231318 A1Published application
Specimen testing package
AssigneesAisin Seiki Kabushiki Kaisha, Mag Array, Inc., Imra America, Inc.
InventorKoji TOYOMARU
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Abstract
A specimen testing package includes a sensor chip provided in its front face with a fixing region of a reactant selectively reacting with a specimen contained in a specimen solution, a substrate to which a back face of the sensor chip is fixed, an external connection lead electrically connected to the sensor chip via a wire, an insulator provided in the substrate for insulating the wire from the outside, and a surrounding wall surrounding the fixing region in form of a continuous loop.
Claims12
A specimen testing package comprising:
- a sensor chip provided in its front face with a fixing region of a reactant selectively reacting with a specimen contained in a specimen solution;
- a substrate to which a back face of the sensor chip is fixed;
- an external connection lead electrically connected to the sensor chip via a wire;
- an insulator provided in the substrate for insulating the wire from the outside;
- and
- a surrounding wall surrounding the fixing region in form of a continuous loop.
3 more elements
Dependencies are inferred from the claim text.