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US 2016/0207161 A1Published application
Method of polishing wafer and wafer polishing apparatus
AssigneeSumco Corporation
InventorTomonori KAWASAKI
Life of this patent
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AssigneeSumco Corporation
InventorTomonori KAWASAKI
Estimating the term…
A practical method of polishing a wafer that can reduce wafer loss due to dummy polishing, and stabilize the LPD count in production wafers at a low level, is provided. in the method of polishing a wafer according to the present disclosure, a wafer 104 is brought into contact with a polishing cloth 112 provided on the surface of a polishing plate 110, and the wafer 104 and the polishing plate 110 are rotated, thereby performing several rounds of a polishing process on the surface of the wafer 104 using the same polishing cloth 112. At this time, the contact angle of the polishing cloth is measured, and based on the measured value thereof, the timing for a switchover from an initial polishing (or a dummy polishing) mode to a production polishing mode is determined.
A method of polishing a wafer, in which a wafer is brought into contact with a polishing cloth provided on a surface of a polishing plate, and the wafer and the polishing plate are rotated, thereby performing several rounds of a polishing process on the surface of the wafer using the same polishing cloth,
A wafer polishing apparatus provided with a head which retains a wafer and a polishing plate having a polishing cloth on its surface, in which the wafer is brought into contact with the polishing cloth, and the wafer and the polishing plate are rotated, thereby performing several rounds of a polishing process for polishing the surface of the wafer using the same polishing cloth, the wafer polishing apparatus comprising:
Dependencies are inferred from the claim text.