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US 2016/0113162 A1Published application
Cover film
AssigneeAsia Electronic Material Co., Ltd.
InventorsChih-Ming Lin, Hui-Feng Lin, Chien-Hui Lee
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Abstract
The present disclosure provides a cover film, including a conductive adhesive layer, an electromagnetic shielding layer formed on the conductive adhesive layer, and an insulating layer formed on the electromagnetic shielding layer. The electromagnetic shielding layer has a thickness of from 0.01 to 25 micrometers, such that the cover film can shield electromagnetic interference through the thinner interposed electromagnetic shielding layer.
Claims20
A cover film, comprising:
- a conductive adhesive layer;
- an electromagnetic shielding layer formed on the conductive adhesive layer and having a thickness of 0.01 to 25 micrometers;
- and
- an insulating layer formed on the electromagnetic shielding layer, wherein the electromagnetic shielding layer is sandwiched between the conductive adhesive layer and the insulating layer.
1 more element
Dependencies are inferred from the claim text.