Method for manufacturing printed circuit board (pcb)
AssigneesHyundai Motor Company, Kia Motors Corporation
InventorsHyung Keun Ko, Mun Jong Kim, Yang Yoon Choi, Kyung Jeon Pakr, Hyun Taek Hwang
Life of this patent
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Abstract
A method for forming a printed circuit board (PCB) includes: depositing, a first time, a photo imageable solder resist (PSR) ink over a top surface and a bottom surface of the PCB including a conductive pattern; drying, a first time, the PCB on which the PSR ink has been deposited for the first time; depositing, a second time, the PSR ink over the top surface and the bottom surface of the PCB; and drying, a second time, the PCB on which the PSR ink has been deposited for the second time.
Claims10
A method for forming a printed circuit board (PCB) comprising:
- depositing, a first time, a photo imageable solder resist (PSR) ink over a top surface and a bottom surface of the PCB including a conductive pattern;
- drying, a first time, the PCB on which the PSR ink has been deposited for the first time;
- depositing, a second time, the PSR ink over the top surface and the bottom surface of the PCB;
- and
- drying, a second time, the PCB on which the PSR ink has been deposited for the second time.
Dependencies are inferred from the claim text.