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US 2016/0106000 A1Published application
Low profile heat sink
AssigneePanasonic Automotive Systems Company of America, Division of Panasonic Corporation of North America
InventorGERALD ANTHONY TANG-KONG
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Abstract
A heat sink for an electronic component includes a base having a width. The base has a greater thickness at a middle portion along the width than at opposite end portions along the width. A plurality of elongate fins project from an upper surface of the base and extend in directions perpendicular to the upper surface.
Claims20
A heat sink for an electronic component, comprising:
- a base having a width, the base having a greater thickness at a middle portion along the width than at opposite end portions along the width;
- and
- a plurality of elongate fins projecting from a surface of the base and extending in directions perpendicular to the surface.
A heat sink for an electronic component, comprising;
- a base having a convexly shaped surface;
- and
- a plurality of elongate fins projecting from the surface of the base and extending in directions perpendicular to the surface.
A heat sink for an electronic component, comprising:
- a base including a surface and having a plurality of substantially parallel channels disposed in the surface;
- and
- a plurality of elongate fins projecting from the surface of the base and extending in directions perpendicular to the surface and parallel to the channels, each said fin being disposed between two adjacent said channels.
Dependencies are inferred from the claim text.