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US 2016/0105171 A1Published application
Semiconductor device having through chip via
AssigneeSK hynix Inc.
InventorHong-Gyeom KIM
Life of this patent
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Abstract
A semiconductor device includes a plurality of chips; a first through-chip via vertically passing through the chips, a power-saving unit suitable for being precharged to a precharge voltage during a precharge period; and a driving unit suitable for driving data using the precharge voltage outputted from the power-saving unit, during a driving period.
Claims17
A semiconductor device comprising:
- a plurality of chips;
- a first through-chip via vertically passing through the chips;
- a power-saving unit suitable for being precharged to a precharge voltage during a precharge period;
- and
- a driving unit suitable for driving data using the precharged voltage outputted from the power-saving unit, during a driving period.
2 more elements
A semiconductor device comprising:
- a plurality of chips;
- a first through-chip via vertically passing through the chips;
- a power-saving unit suitable for being precharged to a precharge voltage based on a voltage level of the first through-chip via;
- and
- a driving unit suitable for driving data using the precharged voltage of the power-saving unit based on a driving enable signal.
2 more elements
An operating method of a semiconductor device including first and second through-chip vias vertically passing through a plurality of chips, comprising:
- precharging the second through-chip via based on a voltage level of the first through-chip via during a precharge period;
- and
- allowing charge-sharing between the first through-chip via and the second through-chip via based on data to drive the first through-chip via, during a driving period.
Dependencies are inferred from the claim text.