Center flex single side polishing head having recess and cap
AssigneeSunEdison Semiconductor Limited (UEN201334164H)
InventorsPeter Albrecht, Sumeet Bhagavat, Alex Chu, Ichiro Yoshimura, Yunbiao Xin, Roland Vandamme
Life of this patent
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Abstract
A polishing head assembly for single side polishing of silicon wafers is provided. The polishing head assembly includes a polishing head and a cap. The polishing head has a recess along a bottom portion, the recess having a recessed surface. The cap is positioned within the recess, and has an annular wall and a floor extending across the annular wall. The floor is spaced from the recessed surface to form a chamber therebetween. The chamber is configured to be pressurized for deflecting the floor. The annular wall is attached to the polishing head with an adhesive.
Claims22
A polishing head assembly for single side polishing of silicon wafers, the polishing head assembly comprising:
- a polishing head having a recess along a bottom portion, the recess having a recessed surface;
- and
- a cap positioned within the recess, the cap having an annular wall and a floor extending across the annular wall, the floor being spaced from the recessed surface to form a chamber therebetween, the chamber configured to be pressurized for deflecting the floor, the annular wall being attached to the polishing head with an adhesive.
Dependencies are inferred from the claim text.